Pre-molded semiconductor packages are well suited for semiconductor applications that require an air cavity between the die and the package. Such applications include devices that need to sense or interact with the environment, such as navigation devices and MEMS based sensors. By using injection molding of thermoplastic materials on lead frames, Unisteel is able to offer a cost-effective solution that is tailored to the back-end manufacturing of such devices. Our pre-molded packages include PDIP, SOIC, SSOP and QFN.